Numerical and Experimental Research on the Laser-Water Jet Scribing of Silicon

Monocrystalline silicon has shown great potential in constructing advanced devices semiconductor, photoelectric, and photochemistry fields. The fabrication of micro-grooves with large depth-to-width ratio (DTWR) low taper is urgent demand as this type groove can significantly promote the device performance. grooves such characterizations hardly be achieved by conventional machining techniques owing to high hardness brittleness silicon. Laser waterjet (LWJ) a promising solution, which capable ablating materials less or no heat defects, well precision, consistency. Therefore, paper firstly established theoretical model describing interaction between LWJ. Through numerical simulation, evolution temperature stress distribution at region was analyzed. Variation experiments were carried out correspondingly. On these bases, scribing put forward aimed discovering influence parameters on morphology. Optimized strategy realizing construction micro-groove DTWR 19.03 0.013 obtained. results contributed understanding LWJ processing small scale broadening application prospects for treating other semiconductor devices.